databridgemarketresearch.com
provides new report titled “Global
Interposer and Fan-Out WLP Market”, By
Geography; Packaging Technology (Fan-out WLP, Interposers Packaging, TSV
Packaging); Application (Imaging & Optoelectronics, LED, Logic, Memory,
MEMS/ Sensors, Photonics, Power, Analog & Mixed Signal, Radio Frequency);
Vertical (Automotive Industrial Sector, Medical Devices, Military &
Aerospace, Smart Technologies, Telecommunication, Consumer Electronics) –
Industry Trends and Forecast to 2024
Market Analysis:
The Global
Interposer and Fan-Out WLP Market accounted for USD 10.09 billion in 2016
growing at a CAGR of 30.76% during the forecast period of 2017 to 2024. The
upcoming market report contains data for historic year 2014, 2015, the base
year of calculation is 2016 and the forecast period is 2017 to 2024.
This report consists of below pages:
·
No of pages: 350
·
No of Figures: 60
·
No of Tables: 220
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Report Definition:
WLP
stands for wafer level packaging. It involves packaging the chip on the wafer,
rather than slicing the wafer first into individual chips and then packaging
them. Such packaging techniques, deliver greater bandwidth, speed, and
reliability. Before WLP, wire-bonding connected chips to a substrate using
wires attached to the edges of the chip. Only so many wires could fit around
the chip, limiting its data transfer capacity. The wires were also relatively
long, which created a timing lag and wasted power.
Company Share Analysis:
The report for global interposer and fan-out WLP
market include detailed vendor level analysis for market shares in
2016 for Global, North America, Europe, Asia Pacific, Middle East and Africa
and South America specifically. Also impact and development analysis of key
vendors is registered in the market and factored on the basis of Vendor
Positioning Grid Analysis which measures the vendors strengths and
opportunities against present market challenges, measure providers ability to
identify or satisfy present market needs, map providers market vision to
current and upcoming market dynamics among others. The report also measures
technology life line curve and market time line to analyze and do more
affective investments.
Major Market Competitors:
Some of the major players of
the global interposer and fan-out WLP market are:
·
Taiwan Semiconductor Manufacturing Company Ltd.
·
Samsung Electronics Co., Ltd.
·
Toshiba Corp.
·
Advanced Semiconductor Engineering Group
·
Amkor Technology and others.
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Summary of Market Drivers and Restraints:
·
High interconnect density and
space efficiencies
·
Demand for use in various smart
technologies due to compact structure of TSVs
·
Provides cost-effective
solution.
Market
Segmentation:
The
global interposer and fan-out WLP market is segmented on the basis of packaging
technology into fan-out WLP, interposers packaging, TSV packaging.
On the basis of vertical, the global interposer and fan-out
WLP market is segmented into automotive industrial sector, medical devices,
military & aerospace, smart technologies, telecommunication, and consumer
electronics.
On the basis of application, the global interposer and fan-out WLP market report is segmented into imaging &
optoelectronics, led, logic, memory, mems/ sensors, photonics, power, analog
& mixed signal, radio frequency .
On the basis of geography, the global interposer and fan-out
WLP market report covers data points for 28 countries across multiple
geographies such as North America, South America, Europe, Asia-Pacific, and
Middle East & Africa. Some of the major countries covered in this report
are U.S., Canada, Germany, France, U.K., Netherlands, Switzerland, Turkey,
Russia, China, India, South Korea, Japan, Australia, Singapore, Saudi Arabia,
South Africa, and Brazil among others. In 2017, North America is expected to
dominate the market.
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Research
Methodology:
Data collection and base
year analysis is done using data collection modules with large sample sizes.
The market data is analyzed and forecasted using market statistical and
coherent models. Also market share analysis and key trend analysis are the
major success factors in the market report. To know more please request an
analyst call or can drop down your inquiry.
Some of the key research
methodologies used by DBMR Research team is Vendor Positioning Grid, Technology
Life Line Curve, Market Time Line Analysis, Market Overview and Guide, Company
Positioning Grid, Company Market Share Analysis, Company Sales In Terms Of
Hardware, Software, And Services Availed, Multivariate Modeling, Standards of
Measurement, Top to Bottom Analysis and Vendor Share Analysis. To know more
about of research skills drop an inquiry to speak to our industry experts.
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